Interpack

PAYPER will showcase its powder bagging solution and host a technical webinar ahead of the fair to present its applications and advantages. At the upcoming Interpack trade show (May 7–13, Düsseldorf), PAYPER will showcase its bottom-up filling system at its booth (Hall 12 – C06), a solution specifically designed to optimize the bagging of fine powdered products. The technology, which has already been introduced in specialized technical forums, expands the company’s portfolio of dosing solutions and addresses one of the most common challenges in industrial bagging: dust generation and the unstable behavior of certain products during filling. A common challenge in bagging powdered products In bagging processes involving products with very fine particle sizes, it is common for air entrapment and dust generation to occur during bag filling. These situations can lead to the dispersion of airborne particles, increased vacuuming requirements, or product loss. The bottom-up filling approach modifies traditional filling dynamics to reduce the product drop height during the dosing process. This principle

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At interpack 2026 in Düsseldorf, Eirich will present forward-looking solutions for the food and pharma sectors from May 7 to 13. The focus is on energy-efficient processes and the intelligent bundling of complex preparation steps. Holistic Solutions for the Process Industry From May 7 to 13, 2026, the global packaging and process industry will meet at this year’s interpack in Düsseldorf. The world’s leading trade fair acts as an international driver for future topics such as sustainability, resource-saving production, and smart manufacturing—areas where Eirich specifically plays to its strengths and presents innovative solutions for energy-efficient, stable, and digitally controlled production processes to the industry. Maximum Process Reliability via Multifunctionality As one of the technological leaders in the industry, the Hardheim-based specialist shows how complex preparation processes can be reliably mastered. The company’s technology combines numerous process steps such as mixing, granulating, kneading, and coating in a single unit. This reduces interfaces, minimizes contamination risks, and ensures optimal results with low energy input—ideal conditions for applications